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High Aspect Ratio Etching

High aspect ratio etching requires precision control of the ion energy distribution (IED) at the wafer surface. EHT bias power systems like Spartan, Hoplite, and Perseus go beyond traditional RF to offer users unprecedented waveform adjustability, which allows for precision control of the IED. These systems can operate at high, average power (5-20 kW) and include active or passive energy recovery making them ideal for industrial semiconductor processing. They can be used in state-of-the-art 300 mm processing facilities or to retrofit older 200 mm systems.